US 11,711,983 B2
High-temperature superconducting striated tape combinations
Joseph C. Prestigiacomo, Springfield, VA (US); Raymond C. Y. Auyeung, Alexandria, VA (US); and Michael S. Osofsky, Clarksville, MD (US)
Assigned to The Government of the United States of America, as represented by the Secretary of the Navy, Arlington, VA (US)
Filed by The Government of the United States of America, as represented by the Secretary of the Navy, Arlington, VA (US)
Filed on Oct. 27, 2022, as Appl. No. 17/975,465.
Application 17/975,465 is a division of application No. 16/218,471, filed on Dec. 12, 2018, granted, now 11,600,762.
Claims priority of provisional application 62/598,541, filed on Dec. 14, 2017.
Claims priority of provisional application 62/598,539, filed on Dec. 14, 2017.
Claims priority of provisional application 62/728,650, filed on Sep. 7, 2018.
Prior Publication US 2023/0081740 A1, Mar. 16, 2023
Int. Cl. H01L 39/24 (2006.01); H10N 60/20 (2023.01); H10N 60/01 (2023.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); B23K 35/02 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); B23K 101/42 (2006.01); B23K 35/26 (2006.01)
CPC H10N 60/203 (2023.02) [B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 35/0222 (2013.01); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 24/03 (2013.01); H10N 60/01 (2023.02); H10N 60/0801 (2023.02); B23K 35/264 (2013.01); B23K 2101/42 (2018.08); H01L 2221/68309 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/05109 (2013.01); H01L 2224/05113 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01322 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A high-temperature superconducting striated tape combination of the process comprising the steps of:
placing a first striated high-temperature superconducting tape with a patterned side facing up and with indexed holes onto an alignment jig using indexing pins as a guide;
placing a solder release tape with preforms and with indexed holes and wherein the preforms are facing the first striated high-temperature superconducting tape onto the first striated high-temperature superconducting tape on the alignment jig;
pressing the solder release tape with preforms wherein the preforms are facing the first striated high-temperature superconducting tape onto the first striated high-temperature superconducting tape;
separating the release tape from the solder preforms;
allowing the solder preforms to remain bonded to the first striated high-temperature superconducting tape;
providing a laser-patterned double sided adhesive with windows and with a first liner and a second liner and with indexed holes;
removing the first liner of the double sided adhesive;
aligning the laser-patterned double sided adhesive over the indexing pins of the alignment jig with adhesive side facing the first striated high-temperature superconducting tape;
placing the laser-patterned double sided adhesive onto the first striated high-temperature superconducting tape;
wherein the windows of the laser-patterned double sided adhesive are aligned with the solder preforms;
removing the second liner from the laser-patterned double sided adhesive;
aligning indexing holes of a second striated high-temperature superconducting tape with patterned side facing the first striated high-temperature superconducting tape over the indexing pins of the alignment jig;
placing the second striated high-temperature superconducting tape onto the laser-patterned double sided adhesive;
applying pressure and/or heat to the first striated high-temperature superconducting tape and to the laser-patterned double sided adhesive and to the second striated high-temperature superconducting tape; and
bonding the first striated high-temperature superconducting tape and the laser-patterned double sided adhesive and the second striated high-temperature superconducting tape.