CPC H10N 60/203 (2023.02) [B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); B23K 35/0222 (2013.01); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 21/6836 (2013.01); H01L 21/6838 (2013.01); H01L 24/03 (2013.01); H10N 60/01 (2023.02); H10N 60/0801 (2023.02); B23K 35/264 (2013.01); B23K 2101/42 (2018.08); H01L 2221/68309 (2013.01); H01L 2224/03003 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/05109 (2013.01); H01L 2224/05113 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01322 (2013.01)] | 13 Claims |
1. A high-temperature superconducting striated tape combination of the process comprising the steps of:
placing a first striated high-temperature superconducting tape with a patterned side facing up and with indexed holes onto an alignment jig using indexing pins as a guide;
placing a solder release tape with preforms and with indexed holes and wherein the preforms are facing the first striated high-temperature superconducting tape onto the first striated high-temperature superconducting tape on the alignment jig;
pressing the solder release tape with preforms wherein the preforms are facing the first striated high-temperature superconducting tape onto the first striated high-temperature superconducting tape;
separating the release tape from the solder preforms;
allowing the solder preforms to remain bonded to the first striated high-temperature superconducting tape;
providing a laser-patterned double sided adhesive with windows and with a first liner and a second liner and with indexed holes;
removing the first liner of the double sided adhesive;
aligning the laser-patterned double sided adhesive over the indexing pins of the alignment jig with adhesive side facing the first striated high-temperature superconducting tape;
placing the laser-patterned double sided adhesive onto the first striated high-temperature superconducting tape;
wherein the windows of the laser-patterned double sided adhesive are aligned with the solder preforms;
removing the second liner from the laser-patterned double sided adhesive;
aligning indexing holes of a second striated high-temperature superconducting tape with patterned side facing the first striated high-temperature superconducting tape over the indexing pins of the alignment jig;
placing the second striated high-temperature superconducting tape onto the laser-patterned double sided adhesive;
applying pressure and/or heat to the first striated high-temperature superconducting tape and to the laser-patterned double sided adhesive and to the second striated high-temperature superconducting tape; and
bonding the first striated high-temperature superconducting tape and the laser-patterned double sided adhesive and the second striated high-temperature superconducting tape.
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