CPC H05K 7/20154 (2013.01) [H05K 7/20145 (2013.01); H05K 7/20445 (2013.01)] | 13 Claims |
1. An apparatus for cooling electronic circuitry, the apparatus comprising:
an enclosure configured to surround the electronic circuitry, the enclosure including a plurality of panels, wherein
a first one of the plurality of panels faces a first direction,
a plurality of air intake holes are disposed in the first one of the plurality of panels only in a portion thereof,
a second one of the plurality of panels faces a second direction that is opposite to that of the first direction, and
a plurality of air exhaust holes are disposed in the second one of the plurality of panels only in a portion thereof; and
an air plenum piece disposed within the enclosure and including
a substantially planar portion that extends from an inner wall of the first one of the plurality of panels and that ends at a distance from an inner wall of the second one of the plurality of panels, and
at least one tab that extends from the substantially planar portion of the air plenum piece to an inner wall of an upper one of the plurality of panels,
the air plenum piece being configured to divide an interior region of the enclosure into a first volume into which the plurality of air intake holes open and a second volume into which the plurality of air exhaust holes open,
the first volume being enclosed by the inner wall of the first one of the plurality of panels, the substantially planar portion of the air plenum piece, the at least one tab of the air plenum piece, and the inner wall of the upper one of the plurality of panels,
the second volume being a remaining volume of the interior region,
the air plenum piece having an air plenum hole that forms an opening between the first volume and the second volume.
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