CPC H05K 1/147 (2013.01) [H10N 30/00 (2023.02); H10N 30/02 (2023.02); H10N 30/87 (2023.02); G01D 11/245 (2013.01)] | 21 Claims |
1. A method for constructing a low-profile, computerized sensing apparatus comprising:
bonding a first flexible circuit sub-assembly, including a sensor electrically coupled to the first flexible circuit sub-assembly, with a second flexible circuit sub-assembly including one or more circuit elements coupled to the second flexible circuit sub-assembly, using die-cut activated adhesive;
positioning the sensor of the first flexible circuit sub-assembly between the first and second flexible circuit sub-assemblies, such that the sensor remains electrically coupled to the first flexible circuit sub-assembly and becomes electrically coupled to the second flexible circuit sub-assembly during bonding, forming a laminated flexible circuit assembly with the sensor within, the laminated flexible circuit assembly retaining flexibility and an ability to conform to a shape of a structure to which it is attached.
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