US 11,711,892 B2
Method of manufacture and use of a flexible computerized sensing device
Eric Oleg Bodnar, San Francisco, CA (US); and Jacob Van Reenen Pretorius, Austin, TX (US)
Assigned to Velvetwire LLC, Santa Cruz, CA (US)
Filed by Eric Oleg Bodnar, San Francisco, CA (US); and Jacob Van Reenen Pretorius, Austin, TX (US)
Filed on Jul. 15, 2019, as Appl. No. 16/512,314.
Prior Publication US 2021/0020824 A1, Jan. 21, 2021
Int. Cl. H05K 1/14 (2006.01); H10N 30/87 (2023.01); H10N 30/00 (2023.01); H10N 30/02 (2023.01); G01D 11/24 (2006.01)
CPC H05K 1/147 (2013.01) [H10N 30/00 (2023.02); H10N 30/02 (2023.02); H10N 30/87 (2023.02); G01D 11/245 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method for constructing a low-profile, computerized sensing apparatus comprising:
bonding a first flexible circuit sub-assembly, including a sensor electrically coupled to the first flexible circuit sub-assembly, with a second flexible circuit sub-assembly including one or more circuit elements coupled to the second flexible circuit sub-assembly, using die-cut activated adhesive;
positioning the sensor of the first flexible circuit sub-assembly between the first and second flexible circuit sub-assemblies, such that the sensor remains electrically coupled to the first flexible circuit sub-assembly and becomes electrically coupled to the second flexible circuit sub-assembly during bonding, forming a laminated flexible circuit assembly with the sensor within, the laminated flexible circuit assembly retaining flexibility and an ability to conform to a shape of a structure to which it is attached.