US 11,710,903 B2
Antenna-like matching component
Olivier Pajona, Nice (FR); Sebastian Rowson, San Diego, CA (US); and Laurent Deselos, San Diego, CA (US)
Assigned to Kyocera AVX Components (San Diego), Inc., San Diego, CA (US)
Filed by Kyocera AVX Components (San Diego), Inc., San Diego, CA (US)
Filed on Nov. 8, 2021, as Appl. No. 17/521,271.
Application 17/521,271 is a continuation of application No. 16/437,531, filed on Jun. 11, 2019, granted, now 11,171,422.
Application 16/437,531 is a continuation of application No. 15/862,553, filed on Jan. 4, 2018, granted, now 10,355,363, issued on Jul. 16, 2019.
Application 15/862,553 is a continuation of application No. 14/213,959, filed on Mar. 14, 2014, granted, now 9,893,427, issued on Feb. 13, 2018.
Claims priority of provisional application 61/838,555, filed on Jun. 24, 2013.
Claims priority of provisional application 61/785,405, filed on Mar. 14, 2013.
Prior Publication US 2022/0059940 A1, Feb. 24, 2022
Int. Cl. H01Q 5/50 (2015.01); H01Q 9/36 (2006.01); H01Q 1/52 (2006.01)
CPC H01Q 9/36 (2013.01) [H01Q 1/52 (2013.01); H01Q 5/50 (2015.01)] 6 Claims
OG exemplary drawing
 
1. A matching component, comprising:
a multilayer substrate of dielectric material, the multilayer substrate comprising a first layer, a second layer and a third layer, the second layer being arranged between the first layer and the third layer;
a first conductive patch arranged on a first side surface of the first layer and a first side surface of the second layer;
a second conductive patch connected to the first conductive patch, the second conductive patch arranged between the second layer and the third layer;
a via in the third layer and connected to the second conductive patch;
a third conductive patch arranged on the third layer, the third conductive patch connected to the via;
a fourth conductive patch arranged on a second side surface of the first layer and a side surface of the second layer;
a fifth conductive patch connected to the fourth conductive patch, the fifth conductive patch arranged between the second layer and the third layer.