CPC H01Q 9/36 (2013.01) [H01Q 1/52 (2013.01); H01Q 5/50 (2015.01)] | 6 Claims |
1. A matching component, comprising:
a multilayer substrate of dielectric material, the multilayer substrate comprising a first layer, a second layer and a third layer, the second layer being arranged between the first layer and the third layer;
a first conductive patch arranged on a first side surface of the first layer and a first side surface of the second layer;
a second conductive patch connected to the first conductive patch, the second conductive patch arranged between the second layer and the third layer;
a via in the third layer and connected to the second conductive patch;
a third conductive patch arranged on the third layer, the third conductive patch connected to the via;
a fourth conductive patch arranged on a second side surface of the first layer and a side surface of the second layer;
a fifth conductive patch connected to the fourth conductive patch, the fifth conductive patch arranged between the second layer and the third layer.
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