CPC H01L 23/49811 (2013.01) [H01L 23/40 (2013.01); H01L 23/49838 (2013.01); H01L 23/5385 (2013.01); H01L 23/562 (2013.01); H05K 1/184 (2013.01); H01L 2023/4087 (2013.01)] | 18 Claims |
1. A semiconductor package, comprising:
one or more substrates coupled together;
one or more pressfit pins coupled to the one or more substrates; and
two or more guide pins coupled directly on a first side of the one or more substrates;
wherein the two or more guide pins have a height greater than the one or more pressfit pins.
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