CPC B81B 7/0083 (2013.01) [B81B 7/007 (2013.01); B81B 7/0077 (2013.01); B81C 1/0023 (2013.01); B81C 1/00301 (2013.01); B81C 1/00333 (2013.01); B81C 1/00341 (2013.01); H01L 23/34 (2013.01); H01L 23/498 (2013.01); H10N 30/302 (2023.02); B81B 2201/0271 (2013.01); B81B 2207/07 (2013.01); B81B 2207/094 (2013.01); B81C 2201/016 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/0154 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/181 (2013.01)] | 20 Claims |
1. An integrated circuit comprising:
a first die having a microelectromechanical system (MEMS) resonator;
a second die having complementary metal oxide semiconductor (CMOS) circuitry;
wherein the first die and the second die are stacked together and are directly electrically interconnected by at least one of wire bonds or solder bumps;
one or more metallic structures on an exterior surface of the integrated circuit, the one or more metaling structures being in electrical communication with the CMOS circuitry;
encapsulation of the first die and the at least one of the wirebonds or solder bumps, relative to the second die, that seals the first die from an atmosphere external to the integrated circuit;
wherein the one or more metallic structures are to electrically connect the integrated circuit with external electronics.
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