CPC B29C 64/364 (2017.08) [B29C 64/124 (2017.08); B29C 64/129 (2017.08); B29C 64/135 (2017.08); B29C 64/232 (2017.08); B29C 64/255 (2017.08); B29C 64/295 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 30/00 (2014.12); G05B 2219/49013 (2013.01)] | 20 Claims |
1. A method for additive manufacturing comprising:
selecting a target bulk resin temperature less than a heat deflection temperature of a resin in a photocured state by a set temperature buffer;
at a reservoir volume of the resin in a liquid state and arranged over a build window, heating the reservoir volume toward the target bulk resin temperature;
selectively heating regions of an interface layer of the resin to bring a temperature across the interface layer toward a target reaction temperature of the resin, the interface layer of the resin interposed between an upper surface of the build window and a preceding layer of a build, and the target reaction temperature of the resin greater than the target bulk resin temperature; and
during a build cycle:
detecting a first temperature of the reservoir volume;
comparing the first temperature to the target bulk resin temperature;
detecting a second temperature of the interface layer;
comparing the second temperature to the target reaction temperature; and
in response to the first temperature being proximal the target bulk resin temperature and in response to the second temperature being proximal the target reaction temperature, selectively photocuring a volume of the resin in the interface layer through the build window to form a photocured resin layer of the build.
|