US 11,707,891 B2
Method for regulating temperature at a resin interface in an additive manufacturing process
Joel Ong, San Francisco, CA (US); Christopher Prucha, San Francisco, CA (US); Stephanie Benight, San Francisco, CA (US); and Bill Buel, San Francisco, CA (US)
Assigned to Stratasys, Inc., Eden Prairie, MN (US)
Filed by Stratasys, Inc., Eden Prairie, MN (US)
Filed on Oct. 13, 2022, as Appl. No. 17/965,685.
Application 17/965,685 is a continuation of application No. 17/066,249, filed on Oct. 8, 2020, granted, now 11,498,279.
Application 17/066,249 is a continuation of application No. 16/852,078, filed on Apr. 17, 2020, granted, now 10,843,411.
Claims priority of provisional application 62/835,444, filed on Apr. 17, 2019.
Prior Publication US 2023/0034915 A1, Feb. 2, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. B29C 64/124 (2017.01); B29C 64/295 (2017.01); B29C 64/364 (2017.01); B29C 64/393 (2017.01); B29C 64/135 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B29C 64/255 (2017.01); B29C 64/232 (2017.01); B29C 64/129 (2017.01); B33Y 40/00 (2020.01); B33Y 30/00 (2015.01)
CPC B29C 64/364 (2017.08) [B29C 64/124 (2017.08); B29C 64/129 (2017.08); B29C 64/135 (2017.08); B29C 64/232 (2017.08); B29C 64/255 (2017.08); B29C 64/295 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 50/02 (2014.12); B33Y 30/00 (2014.12); G05B 2219/49013 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method for additive manufacturing comprising:
selecting a target bulk resin temperature less than a heat deflection temperature of a resin in a photocured state by a set temperature buffer;
at a reservoir volume of the resin in a liquid state and arranged over a build window, heating the reservoir volume toward the target bulk resin temperature;
selectively heating regions of an interface layer of the resin to bring a temperature across the interface layer toward a target reaction temperature of the resin, the interface layer of the resin interposed between an upper surface of the build window and a preceding layer of a build, and the target reaction temperature of the resin greater than the target bulk resin temperature; and
during a build cycle:
detecting a first temperature of the reservoir volume;
comparing the first temperature to the target bulk resin temperature;
detecting a second temperature of the interface layer;
comparing the second temperature to the target reaction temperature; and
in response to the first temperature being proximal the target bulk resin temperature and in response to the second temperature being proximal the target reaction temperature, selectively photocuring a volume of the resin in the interface layer through the build window to form a photocured resin layer of the build.