US 11,706,905 B2
Module
Koji Furutani, Kyoto (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Kyoto (JP)
Filed by Murata Manufacturing Co., Ltd., Kyoto (JP)
Filed on Jan. 19, 2021, as Appl. No. 17/151,962.
Application 17/151,962 is a continuation of application No. PCT/JP2019/028070, filed on Jul. 17, 2019.
Claims priority of application No. 2018-136485 (JP), filed on Jul. 20, 2018.
Prior Publication US 2021/0144880 A1, May 13, 2021
Int. Cl. H01L 23/14 (2006.01); H05K 7/20 (2006.01); H05K 1/11 (2006.01)
CPC H05K 7/209 (2013.01) [H01L 23/14 (2013.01); H05K 1/11 (2013.01); H05K 2201/0355 (2013.01)] 19 Claims
OG exemplary drawing
 
10. A module comprising:
a substrate having a polygonal shape in a plan view; a first electronic component mounted on one main surface of the substrate; and
side electrodes provided on a plurality of side surfaces forming the polygonal shape of the substrate, wherein
a first conductor film and a fifth conductor film are provided on the substrate, each of the first conductor film and the fifth conductor film being coupled to the first electronic component,
the first conductor film extends to reach a first side surface of the plurality of side surfaces to be coupled to the side electrodes provided on the first side surface, and
the fifth conductor film extends to reach a third side surface of the plurality of side surfaces the third side surface being different from the first side surface.