US 11,706,899 B2
Electronics enclosure with heat-transfer element
Nikhil R. Lakhkar, Troy, OH (US); Kevin J. Gehret, Fort Loramie, OH (US); and Russ M. Beisner, Versailles, OH (US)
Assigned to Emerson Climate Technologies, Inc., Sidney, OH (US)
Filed by Emerson Climate Technologies, Inc., Sidney, OH (US)
Filed on Dec. 13, 2021, as Appl. No. 17/643,991.
Application 17/643,991 is a continuation of application No. 16/935,786, filed on Jul. 22, 2020, granted, now 11,206,743.
Claims priority of provisional application 62/878,497, filed on Jul. 25, 2019.
Prior Publication US 2022/0104391 A1, Mar. 31, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 7/20 (2006.01); F04B 39/06 (2006.01)
CPC H05K 7/20145 (2013.01) [F04B 39/066 (2013.01); H05K 7/20154 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An assembly comprising:
a compressor including a compressor shell, a compression mechanism disposed within the compressor shell, and a motor driving the compression mechanism;
an enclosure physically connected to the compressor and defining an internal cavity;
a control module in communication with the compressor and configured to control operation of the compressor;
a fan disposed within the internal cavity; and
an airflow deflector having a base portion, a first leg, and a second leg, wherein the first and second legs are spaced apart from each other and extend from the base portion,
wherein the fan forces air against the base portion, wherein a first portion of the air flows from the base portion along the first leg, and wherein a second portion of the air flows from the base portion along the second leg.