US 11,706,874 B2
Electronic-circuit printing using low-cost ink
Siyuan Ma, Bothell, WA (US); and James David Holbery, Bellevue, WA (US)
Assigned to Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed by Microsoft Technology Licensing, LLC, Redmond, WA (US)
Filed on Aug. 6, 2019, as Appl. No. 16/533,656.
Prior Publication US 2021/0045251 A1, Feb. 11, 2021
Int. Cl. H05K 3/12 (2006.01); C09D 11/52 (2014.01); H05K 1/09 (2006.01)
CPC H05K 3/125 (2013.01) [C09D 11/52 (2013.01); H05K 1/092 (2013.01); H05K 3/1258 (2013.01); H05K 3/1283 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An article comprising:
a substrate;
an electronically conductive film arranged on the substrate, the electronically conductive film including a plurality of copper particles and eutectic gallium-indium, the eutectic gallium-indium bridging the plurality of copper particles, the plurality of copper particles being wettable and/or alloyable by the eutectic gallium-indium, wherein a ratio of mass of the eutectic gallium-indium to mass of the plurality of copper particles is within a range of 0.1:20 to 20:0.1;
a flux material configured to remove an oxide from a surface of the eutectic gallium-indium when heated to an activation temperature; and
a barrier layer covering the substrate and the electronically conductive film.