CPC H05B 6/101 (2013.01) [H01B 1/04 (2013.01); H01C 13/00 (2013.01); H01G 4/33 (2013.01); H05B 1/0236 (2013.01); H05B 3/145 (2013.01); H05B 3/20 (2013.01); H05B 3/265 (2013.01); H05B 3/267 (2013.01); H05B 2203/011 (2013.01); H05B 2203/013 (2013.01); H05B 2203/016 (2013.01); H05B 2203/017 (2013.01); H05B 2214/02 (2013.01); H05B 2214/04 (2013.01)] | 14 Claims |
1. A system comprising:
an object formed incorporating a multifunctional assembly having a stacked, layered structure, the multifunctional assembly including:
a first resistive layer,
a first conductive layer electrically coupled to and stacked on the first resistive layer to distribute an electrical current through the first resistive layer, and
a first pair of insulating layers including a first insulating layer stacked on and disposed across the first resistive layer and a second insulating layer stacked on and disposed across the first conductive layer on a side opposing the first resistive layer; and
a control system including a processor and LCR (inductance, capacitance, resistance) circuitry couplable to the first resistive layer via the conductive layer and configured or programmed to directly or indirectly measure or detect a change in a structural configuration, structural integrity or structural health characteristic of the object, wherein the change in the structural configuration, structural integrity or structural health characteristic of the object is indicated by a change in electrical conductivity or resistance across the first resistive layer.
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