US 11,706,848 B2
Multifunctional assemblies
Seth S. Kessler, Newton, MA (US); Gregory A. Thomas, San Francisco, CA (US); Christopher T. Dunn, Salem, MA (US); Michael Borgen, Wilmington, MA (US); and Brian L. Wardle, Lexington, MA (US)
Assigned to Metis Design Corporation, Boston, MA (US)
Filed by Metis Design Corporation, Boston, MA (US)
Filed on Jan. 14, 2022, as Appl. No. 17/576,019.
Application 17/576,019 is a continuation of application No. 14/678,066, filed on Apr. 3, 2015.
Claims priority of provisional application 62/057,728, filed on Sep. 30, 2014.
Claims priority of provisional application 61/978,152, filed on Apr. 10, 2014.
Claims priority of provisional application 61/978,154, filed on Apr. 10, 2014.
Prior Publication US 2022/0191978 A1, Jun. 16, 2022
Int. Cl. H05B 6/10 (2006.01); H05B 3/26 (2006.01); H01B 1/04 (2006.01); H01C 13/00 (2006.01); H01G 4/33 (2006.01); H05B 1/02 (2006.01); H05B 3/14 (2006.01); H05B 3/20 (2006.01)
CPC H05B 6/101 (2013.01) [H01B 1/04 (2013.01); H01C 13/00 (2013.01); H01G 4/33 (2013.01); H05B 1/0236 (2013.01); H05B 3/145 (2013.01); H05B 3/20 (2013.01); H05B 3/265 (2013.01); H05B 3/267 (2013.01); H05B 2203/011 (2013.01); H05B 2203/013 (2013.01); H05B 2203/016 (2013.01); H05B 2203/017 (2013.01); H05B 2214/02 (2013.01); H05B 2214/04 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A system comprising:
an object formed incorporating a multifunctional assembly having a stacked, layered structure, the multifunctional assembly including:
a first resistive layer,
a first conductive layer electrically coupled to and stacked on the first resistive layer to distribute an electrical current through the first resistive layer, and
a first pair of insulating layers including a first insulating layer stacked on and disposed across the first resistive layer and a second insulating layer stacked on and disposed across the first conductive layer on a side opposing the first resistive layer; and
a control system including a processor and LCR (inductance, capacitance, resistance) circuitry couplable to the first resistive layer via the conductive layer and configured or programmed to directly or indirectly measure or detect a change in a structural configuration, structural integrity or structural health characteristic of the object, wherein the change in the structural configuration, structural integrity or structural health characteristic of the object is indicated by a change in electrical conductivity or resistance across the first resistive layer.