US 11,705,695 B2
Light emitting device
Kazuhiro Sakai, Kanagawa (JP); Daisuke Iguchi, Kanagawa (JP); Takeshi Minamiru, Kanagawa (JP); Yoshinori Shirakawa, Kanagawa (JP); Tomoaki Sakita, Kanagawa (JP); and Tsutomu Otsuka, Kanagawa (JP)
Assigned to FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed by FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed on Nov. 16, 2021, as Appl. No. 17/528,177.
Application 17/528,177 is a continuation of application No. 16/719,940, filed on Dec. 18, 2019, granted, now 11,211,774.
Claims priority of application No. 2019-076837 (JP), filed on Apr. 15, 2019.
Prior Publication US 2022/0077659 A1, Mar. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01S 5/02257 (2021.01); H01S 5/02345 (2021.01); H01S 5/42 (2006.01); H01S 5/183 (2006.01); H01S 5/068 (2006.01); G02B 5/02 (2006.01); G06V 20/64 (2022.01); G06V 10/145 (2022.01); G06V 40/16 (2022.01); H01S 5/0687 (2006.01); G02B 27/42 (2006.01); H01S 5/02255 (2021.01); H01S 5/02325 (2021.01); H01S 5/042 (2006.01); H01S 5/02 (2006.01); H01S 5/30 (2006.01); H01S 5/343 (2006.01); H01S 5/20 (2006.01)
CPC H01S 5/423 (2013.01) [G02B 5/0278 (2013.01); G02B 27/4205 (2013.01); G06V 10/145 (2022.01); G06V 20/64 (2022.01); G06V 40/166 (2022.01); H01S 5/02255 (2021.01); H01S 5/02325 (2021.01); H01S 5/0687 (2013.01); H01S 5/06804 (2013.01); H01S 5/0206 (2013.01); H01S 5/04252 (2019.08); H01S 5/04254 (2019.08); H01S 5/18347 (2013.01); H01S 5/18361 (2013.01); H01S 5/2054 (2013.01); H01S 5/3054 (2013.01); H01S 5/34353 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A light emitting device comprising:
a wiring substrate;
a light emitting element array, provided on a first side of the wiring substrate;
a driving element, provided on the first side of the wiring substrate; and
a wiring pattern, provided on the first side of the wiring substrate;
wherein the wiring pattern connects the light emitting element array to the driving element, the wiring pattern is provided between the wiring substrate and a portion of the driving element, and the wiring pattern is provided between the wiring substrate and an entire light emitting element array, and the wiring pattern does not connect to any circuit elements that provided on an opposite side of the light emitting array to the driving element.