US 11,705,652 B2
Apparatus for surface mount connectors
Jian Miremadi, Palo Alto, CA (US); David A. Moore, Tomball, TX (US); John Norton, Houston, TX (US); and Eduardo F. Velazquez, Aguadilla, PR (US)
Assigned to Hewlett Packard Enterprise Development LP, Spring, TX (US)
Filed by Hewlett Packard Enterprise Development LP, Houston, TX (US)
Filed on Oct. 27, 2020, as Appl. No. 16/949,372.
Application 16/949,372 is a division of application No. 16/400,540, filed on May 1, 2019, granted, now 10,833,438.
Prior Publication US 2021/0044039 A1, Feb. 11, 2021
Int. Cl. H01R 12/70 (2011.01); H05K 1/18 (2006.01); H01R 13/11 (2006.01); H01R 12/71 (2011.01)
CPC H01R 12/707 (2013.01) [H01R 12/716 (2013.01); H01R 13/113 (2013.01); H05K 1/181 (2013.01); H05K 2201/10189 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus comprising:
an elongated body constructed from a heat resistant material, the elongated body being configured to couple with a surface mount connector to reduce or prevent deformation of the surface mount connector during soldering of the surface mount connector to a substrate in a reflow oven by providing structural rigidity to the surface mount connector, the surface mount connector including a connector housing having a first end portion and a second end portion,
wherein the elongated body is formed from a slab,
wherein the slab is planar, defines a plurality of slots, and forms a first tab at a first end portion and second tab at a second end portion of the slab, each of the plurality of slots comprising an elongated hole having a greatest length extending along a longitudinal axis of the slab, and
wherein the slab is configured to rest directly upon a surface of the connector housing extending between the first and second end portions of the connector housing and the first and second tabs of the slab are configured to insert into a respective socket at each of the first and second end portions of the connector housing to couple the elongated body to the surface mount connector.