US 11,705,640 B2
Antenna modules in phased array antennas
Javier Rodriguez De Luis, Kirkland, WA (US); Nil Apaydin, Kirkland, WA (US); Ersin Yetisir, Redmond, WA (US); Alireza Mahanfar, Kirkland, WA (US); and Siamak Ebadi, San Francisco, CA (US)
Assigned to Space Exploration Technologies Corp., Hawthorne, CA (US)
Filed by Space Exploration Technologies Corp., Hawthorne, CA (US)
Filed on Jan. 25, 2022, as Appl. No. 17/583,654.
Application 17/583,654 is a continuation of application No. 16/858,691, filed on Apr. 26, 2020, granted, now 11,309,638.
Claims priority of provisional application 62/845,780, filed on May 9, 2019.
Prior Publication US 2022/0149540 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 1/38 (2006.01); H01Q 21/00 (2006.01); H01Q 3/26 (2006.01)
CPC H01Q 21/0087 (2013.01) [H01Q 1/38 (2013.01); H01Q 3/26 (2013.01); H01Q 21/0025 (2013.01)] 29 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a plurality of conductive structures having first sides and second sides opposite the first sides, wherein the second sides of the plurality of conductive structures are configured to be physically coupleable with a printed circuit board (PCB) of a receiver or a transmitter, and wherein the first sides of the plurality of conductive structures are configured to be spaced from the PCB by a first distance when the plurality of conductive structures is physically coupled with the PCB; and
an antenna having a first side and a second side opposite the first side, wherein the first side comprises a radiating side of the antenna and the second side of the antenna is disposed closer to the plurality of conductive structures than the first side of the antenna when the plurality of conductive structures is physically coupled with the PCB.