US 11,705,624 B2
Wiring board and method for manufacturing wiring board
Koichi Suzuki, Tokyo-to (JP); Seiji Take, Tokyo-to (JP); and Daisuke Matsuura, Tokyo-to (JP)
Assigned to DAI NIPPON PRINTING CO., LTD., Tokyo (JP)
Appl. No. 16/768,254
Filed by DAI NIPPON PRINTING CO., LTD., Tokyo-to (JP)
PCT Filed Nov. 29, 2018, PCT No. PCT/JP2018/043909
§ 371(c)(1), (2) Date May 29, 2020,
PCT Pub. No. WO2019/107476, PCT Pub. Date Jun. 6, 2019.
Claims priority of application No. 2017-229272 (JP), filed on Nov. 29, 2017; application No. 2018-045941 (JP), filed on Mar. 13, 2018; and application No. 2018-053281 (JP), filed on Mar. 20, 2018.
Prior Publication US 2020/0373653 A1, Nov. 26, 2020
Int. Cl. H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 1/16 (2006.01); H05K 3/12 (2006.01); H05K 3/18 (2006.01); H05K 7/04 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01L 21/70 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 23/522 (2006.01); H01L 23/535 (2006.01); H01L 27/00 (2006.01); H01L 27/02 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H01L 27/115 (2017.01); H05K 3/10 (2006.01)
CPC H01Q 1/36 (2013.01) [H05K 1/0274 (2013.01); H05K 3/108 (2013.01); H05K 3/18 (2013.01); H05K 2201/10098 (2013.01); H05K 2203/0723 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A wiring board comprising:
a substrate having transparency;
a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction, each of the first wirings having:
a back surface in contact with the substrate;
a front surface facing an opposite side of the back surface; and
a pair of side surfaces which extend in the first direction and are adjacent to the back surface, each of the pair of side surfaces being recessed inward; and
a second wiring which is arranged on the upper surface of the substrate and extends in a second direction intersecting with the first direction, the second wiring having:
a back surface in contact with the substrate;
a front surface facing an opposite side of the back surface of the second wiring;
one side surface that extends in the second direction, is adjacent to the back surface of the second wiring, and is recessed inward; and
another side surface that extends in the second direction, is adjacent to the back surface of the second wiring, and is recessed inward, an angle between the back surface of the second wiring and the other side surface being smaller than an angle between the back surface of the second wiring and the one side surface.