US 11,705,434 B2
Semiconductor device
Masayuki Miura, Ota Tokyo (JP); Yuichi Sano, Setagaya Tokyo (JP); and Kazuma Hasegawa, Kamakura Kanagawa (JP)
Assigned to KIOXIA CORPORATION, Tokyo (JP)
Filed by Kioxia Corporation, Tokyo (JP)
Filed on Aug. 27, 2021, as Appl. No. 17/459,376.
Claims priority of application No. 2021-035711 (JP), filed on Mar. 5, 2021.
Prior Publication US 2022/0285319 A1, Sep. 8, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 23/49816 (2013.01); H01L 25/50 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06562 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a first stacked body including a plurality of first semiconductor chips stacked on top of one another in a first direction and offset relative to each other in a second direction perpendicular to the first direction;
a first columnar electrode coupled to an electrode pad of the first semiconductor chip and extending in the first direction;
a second stacked body arranged relative to the first stacked body in the second direction and including a plurality of second semiconductor chips stacked on top of one another in the first direction and offset relative to each other in the second direction;
a second columnar electrode coupled to an electrode pad of the second semiconductor chip and extending in the first direction; and
a third semiconductor chip arranged substantially equally spaced to the first columnar electrode and the second columnar electrode.