US 11,705,429 B2
Redundant through-silicon vias
Jason M. Brown, Allen, TX (US); and Vijayakrishna J. Vankayala, Allen, TX (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Sep. 4, 2020, as Appl. No. 17/13,225.
Prior Publication US 2022/0077112 A1, Mar. 10, 2022
Int. Cl. G11C 11/00 (2006.01); H01L 25/065 (2023.01); G11C 13/00 (2006.01); G11C 29/00 (2006.01); H10B 63/00 (2023.01)
CPC H01L 25/0657 (2013.01) [G11C 13/004 (2013.01); G11C 13/0069 (2013.01); G11C 29/702 (2013.01); G11C 13/003 (2013.01); G11C 13/0026 (2013.01); G11C 13/0028 (2013.01); G11C 2013/0045 (2013.01); H01L 2225/06544 (2013.01); H10B 63/84 (2023.02)] 19 Claims
OG exemplary drawing
 
1. A device, comprising:
a first die comprising a first circuit, wherein the first circuit is configured to couple to a first buffer circuit and a second buffer circuit, and wherein the first buffer circuit is configured to receive first data generated by a first data source and the second buffer circuit is configured to receive second data generated by a second data source, and wherein the second data is independent of the first data;
a second die comprising a second circuit;
a material layer disposed between the first die and the second die and comprising a plurality of through-silicon vias (TSVs) for electrically coupling the first die to the second die, wherein a first TSV of the plurality of TSVs is associated with only three buffer circuits and is configured to electrically couple the first circuit to the second circuit, and a second TSV of the plurality of TSVs comprises a redundant TSV configured to electrically bypass the first TSV to couple the first circuit to the second circuit if a fault is detected in the first TSV; and
a control system configured to:
at a first time:
transmit the first data from the first circuit to the second circuit using the first TSV; and
transmit the second data from the first circuit to the second circuit using a third TSV of the plurality of TSVs; and
at a second time:
turn off a first switch and turn on a second switch to route third data from the first circuit to the second circuit using the third TSV, thereby bypassing the first TSV; and
turn off a third switch and turn on a fourth switch to route fourth data from the first circuit to the second circuit using the second TSV as opposed to the third TSV.