CPC H01L 25/0652 (2013.01) [H01L 21/60 (2021.08); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/50 (2013.01)] | 22 Claims |
1. An electronic device, comprising:
a substrate having contact pads disposed thereon and traces interconnecting the contact pads;
a first integrated circuit (IC) die, which is mounted on the substrate and comprises a predefined set of circuit components arranged on the first IC die in a first geometrical pattern, which is non-symmetrical under reflection about a given axis in a plane of the die; and
a second IC die, which is mounted on the substrate and comprises the predefined set of circuit components arranged on the second IC die in a second geometrical pattern, which is a mirror image of the first geometrical pattern with respect to the given axis.
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