US 11,705,427 B2
Mirror-image chips on a common substrate
Ido Bourstein, Pardes Hana-Karkur (IL)
Assigned to MELLANOX TECHNOLOGIES, LTD., Yokneam (IL)
Filed by MELLANOX TECHNOLOGIES, LTD., Yokneam (IL)
Filed on Oct. 5, 2021, as Appl. No. 17/493,882.
Prior Publication US 2023/0105149 A1, Apr. 6, 2023
Int. Cl. H01L 25/065 (2023.01); H01L 25/00 (2006.01); H01L 21/60 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/0652 (2013.01) [H01L 21/60 (2021.08); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 25/50 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a substrate having contact pads disposed thereon and traces interconnecting the contact pads;
a first integrated circuit (IC) die, which is mounted on the substrate and comprises a predefined set of circuit components arranged on the first IC die in a first geometrical pattern, which is non-symmetrical under reflection about a given axis in a plane of the die; and
a second IC die, which is mounted on the substrate and comprises the predefined set of circuit components arranged on the second IC die in a second geometrical pattern, which is a mirror image of the first geometrical pattern with respect to the given axis.