US 11,705,424 B2
Spring electrode for press-pack power semiconductor module
Shigeto Fujita, Tokyo (JP); and Tetsuya Matsuda, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 16/629,658
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Aug. 31, 2017, PCT No. PCT/JP2017/031365
§ 371(c)(1), (2) Date Jan. 9, 2020,
PCT Pub. No. WO2019/043870, PCT Pub. Date Mar. 7, 2019.
Prior Publication US 2020/0152595 A1, May 14, 2020
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/72 (2013.01) 20 Claims
OG exemplary drawing
 
1. A spring electrode for a press-pack power semiconductor module, comprising:
a first electrode in contact with a power semiconductor chip;
a second electrode arranged to face the first electrode; and
a pressure pad which connects the first electrode and the second electrode and has flexibility in a normal direction of opposing surfaces of the first electrode and the second electrode,
wherein the opposing surfaces of the first electrode and the second electrode are polygons of a pentagon or more, and
wherein sides of the opposing surface of the first electrode and sides of the opposing surface of the second electrode corresponding to these sides are connected in parallel by the pressure pad.