CPC H01L 24/72 (2013.01) | 20 Claims |
1. A spring electrode for a press-pack power semiconductor module, comprising:
a first electrode in contact with a power semiconductor chip;
a second electrode arranged to face the first electrode; and
a pressure pad which connects the first electrode and the second electrode and has flexibility in a normal direction of opposing surfaces of the first electrode and the second electrode,
wherein the opposing surfaces of the first electrode and the second electrode are polygons of a pentagon or more, and
wherein sides of the opposing surface of the first electrode and sides of the opposing surface of the second electrode corresponding to these sides are connected in parallel by the pressure pad.
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