US 11,705,421 B2
Apparatus including solder-core connectors and methods of manufacturing the same
Po Chih Yang, Taichung (TW); Po Chen Kuo, Taichung (TW); and Chih Hong Wang, Taichung (TW)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Apr. 15, 2021, as Appl. No. 17/231,847.
Prior Publication US 2022/0336397 A1, Oct. 20, 2022
Int. Cl. H01L 23/00 (2006.01); H01L 23/488 (2006.01); H01L 23/532 (2006.01)
CPC H01L 24/14 (2013.01) [H01L 23/488 (2013.01); H01L 23/53228 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor die having an interface surface; and
a connector protruding from the interface surface, the connector including:
a peripheral wall on the interface surface and having a wall height measured along a direction orthogonal to the interface surface, wherein the peripheral wall includes an electrically conductive material, and
a solder core encircled by the peripheral wall and having a core height measured along the direction orthogonal to the interface surface, wherein:
the solder core directly contacts the interface surface for reducing stress within the semiconductor die,
the core height is greater than the wall height, and
the solder core functions together with the peripheral wall to provide an electrical connection to the semiconductor die.