US 11,705,383 B2
Through mold interconnect drill feature
Robert M. Nickerson, Chandler, AZ (US); Rees Winters, Glendale, AZ (US); and Purushotham Kaushik Muthur Srinath, Chandler, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Aug. 26, 2019, as Appl. No. 16/550,773.
Prior Publication US 2021/0066167 A1, Mar. 4, 2021
Int. Cl. H01L 23/31 (2006.01); H01L 23/48 (2006.01)
CPC H01L 23/481 (2013.01) [H01L 23/315 (2013.01)] 23 Claims
OG exemplary drawing
 
1. An electronic package, comprising:
a package substrate;
a first die electrically coupled to the package substrate;
a second die coupled to a top surface of the first die;
a mold layer over the package substrate and around the first die and the second die;
a through mold opening through the mold layer; and
a through mold interconnect (TMI) in the through mold opening, wherein a center of the TMI is offset from a center of the through mold opening, the TMI laterally spaced apart from the first die and laterally spaced apart from the second die.