US 11,705,382 B2
Two-dimensional addessable array of piezoelectric MEMS-based active cooling devices
Suryaprakash Ganti, Los Altos, CA (US); and Seshagiri Rao Madhavapeddy, La Jolla, CA (US)
Assigned to Frore Systems Inc., San Jose, CA (US)
Filed by Frore Systems Inc., San Jose, CA (US)
Filed on Feb. 18, 2021, as Appl. No. 17/179,263.
Application 17/179,263 is a continuation of application No. 16/369,777, filed on Mar. 29, 2019, granted, now 11,043,444.
Claims priority of provisional application 62/717,474, filed on Aug. 10, 2018.
Prior Publication US 2021/0183743 A1, Jun. 17, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/433 (2006.01); H01L 23/473 (2006.01); F04B 53/10 (2006.01); F04B 43/04 (2006.01); F04B 45/047 (2006.01); B06B 1/06 (2006.01); H01L 23/427 (2006.01); H05K 7/20 (2006.01); F25B 21/02 (2006.01); F04D 33/00 (2006.01); H04M 1/02 (2006.01); F04B 43/09 (2006.01); H01L 23/46 (2006.01); H01L 23/42 (2006.01); F04B 17/00 (2006.01); F04B 45/04 (2006.01); F04B 39/06 (2006.01); H10N 30/00 (2023.01); H10N 30/20 (2023.01); H10N 30/80 (2023.01); H10N 35/80 (2023.01); F04B 43/08 (2006.01)
CPC H01L 23/4735 (2013.01) [B06B 1/06 (2013.01); F04B 17/003 (2013.01); F04B 39/06 (2013.01); F04B 43/046 (2013.01); F04B 43/095 (2013.01); F04B 45/043 (2013.01); F04B 45/047 (2013.01); F04B 53/1077 (2013.01); F04D 33/00 (2013.01); F25B 21/02 (2013.01); H01L 23/42 (2013.01); H01L 23/427 (2013.01); H01L 23/433 (2013.01); H01L 23/4336 (2013.01); H01L 23/46 (2013.01); H01L 23/473 (2013.01); H04M 1/0202 (2013.01); H05K 7/20 (2013.01); H05K 7/20009 (2013.01); H05K 7/2039 (2013.01); H05K 7/20272 (2013.01); H05K 7/20281 (2013.01); H10N 30/00 (2023.02); H10N 30/20 (2023.02); H10N 30/204 (2023.02); H10N 30/2047 (2023.02); H10N 30/80 (2023.02); H10N 35/80 (2023.02); F04B 43/08 (2013.01); F25B 2321/023 (2013.01); F25B 2321/025 (2013.01); F25B 2321/0212 (2013.01); F25B 2321/0252 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A cooling system comprising:
a plurality of piezoelectric cooling elements spatially arranged in at least one array, the at least one array extending in at least two dimensions, having a first side distal from at least one heat-generating structure, and having a second side proximate to the at least one heat-generating structure, the at least one array including a plurality of apertures on the first side of the at least one array and a plurality of orifices on the second side of the at least one array, the plurality of apertures corresponding to the plurality of piezoelectric cooling elements, the plurality of piezoelectric cooling elements being between the plurality apertures and the at least one heat-generating structure, the plurality of piezoelectric cooling elements being between the plurality of apertures and the plurality of orifices, the plurality of piezoelectric cooling elements configured to draw fluid through the plurality of apertures on the first side of the at least one array and to drive the fluid from the first side of the at least one array to the second side of the at least one array and through the plurality of orifices;
a communications interface associated with the piezoelectric cooling elements such that selected piezoelectric cooling elements within the array can be activated; and
driving circuitry associated with the plurality of piezoelectric cooling elements and configured to drive the selected piezoelectric cooling elements.