US 11,705,366 B2
Methods for controllable metal and barrier-liner recess
He Ren, San Jose, CA (US); Amrita B. Mullick, Santa Clara, CA (US); Regina Freed, Los Altos, CA (US); Mehul Naik, San Jose, CA (US); and Uday Mitra, Cupertino, CA (US)
Assigned to Micromaterials LLC, Wilmington, DE (US)
Filed by Micromaterials LLC, Wilmington, DE (US)
Filed on Jun. 11, 2021, as Appl. No. 17/345,683.
Application 17/345,683 is a division of application No. 16/214,522, filed on Dec. 10, 2018, granted, now 11,062,942.
Claims priority of provisional application 62/596,113, filed on Dec. 7, 2017.
Prior Publication US 2021/0305091 A1, Sep. 30, 2021
Int. Cl. H01L 21/768 (2006.01)
CPC H01L 21/76849 (2013.01) [H01L 21/7685 (2013.01); H01L 21/76814 (2013.01); H01L 21/76825 (2013.01); H01L 21/76826 (2013.01); H01L 21/76829 (2013.01); H01L 21/76831 (2013.01); H01L 21/76834 (2013.01); H01L 21/76865 (2013.01); H01L 21/76883 (2013.01); H01L 21/76897 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A processing method comprising:
providing a substrate comprising a dielectric material with at least one feature formed thereon, the at least one feature having at least one sidewall and a bottom, a distance from a surface of the dielectric material to the bottom of the feature defining a depth of the feature;
passivating the dielectric material at the sidewall of the feature to form a passivated dielectric layer, wherein passivating the dielectric material at the sidewall of the feature forms a gradient passivated dielectric layer so that a portion of the sidewall from surface of the dielectric material to a predetermined depth is modified so that removal of the barrier layer from the passivated dielectric material is easier than removal of the barrier layer from the dielectric material;
forming a barrier layer on the at least one sidewall on the passivated dielectric layer and the bottom of the at least one feature;
depositing a metal layer in the feature to fill the at least one feature; and
removing a portion of the metal layer and the barrier layer to a predetermined depth and remove the barrier layer from the passivated dielectric layer.