CPC H01H 59/0009 (2013.01) | 14 Claims |
1. A microelectromechanical device, comprising:
a backplane comprising at least two RF conductors;
a plurality of bottom electrodes disposed on the backplane;
a top electrode disposed above and spaced from the backplane;
a beam disposed between the backplane and the top electrode, the beam moveable between the at least two RF conductors and the top electrode, wherein the beam comprises one or more hinge sections and at least two stiff waffle sections, wherein a hinge section of the one or more hinge sections is disposed between adjacent waffle sections of the at least two stiff waffle sections;
at least two RF stacks disposed above the at least two RF conductors; and
a center stack disposed between the at least two RF stacks, wherein the one or more hinge sections comprise a first hinge section configured to contact the center stack prior to the beam contacting the at least two RF stacks.
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