US 11,705,278 B2
Multi-layer ceramic electronic component, circuit board, and method of producing a multi-layer ceramic electronic component
Kunihiro Matsushita, Takasaki (JP); and Takashi Sasaki, Takasaki (JP)
Assigned to TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed by TAIYO YUDEN CO., LTD., Tokyo (JP)
Filed on Apr. 20, 2021, as Appl. No. 17/235,791.
Claims priority of application No. 2020-077031 (JP), filed on Apr. 24, 2020.
Prior Publication US 2021/0335542 A1, Oct. 28, 2021
Int. Cl. H01G 4/012 (2006.01); H01G 4/30 (2006.01); H01G 2/06 (2006.01); H01G 4/008 (2006.01); H01G 4/12 (2006.01)
CPC H01G 4/012 (2013.01) [H01G 2/065 (2013.01); H01G 4/008 (2013.01); H01G 4/1218 (2013.01); H01G 4/30 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A multi-layer ceramic electronic component, comprising:
a ceramic body including
an end surface facing in a first direction, and
internal electrodes exposed from the end surface and laminated in a second direction orthogonal to the first direction,
wherein the end surface has two first peripheral portions being disposed opposite each other in a third direction orthogonal to the first direction and the second direction, and two second peripheral portions being disposed opposite each other in the second direction; and
an external electrode provided on the end surface and including two protrusions that are formed continuously along the two first peripheral portions of the end surface, respectively, and protrude in the first direction,
wherein the external electrode includes no protrusions protruding in the first direction and extending continuously along the two second peripheral portions of the end surface,
and wherein a dimension of each of the two protrusions in the third direction is 15 μm or more and 60 μm or less.