	US 11,702,570 B2
	Polishing composition
Ryota Mae, Kiyosu (JP); Tsutomu Yoshino, Kiyosu (JP); Shogo Onishi, Kiyosu (JP); Hirofumi Ikawa, Kiyosu (JP); and Yasuto Ishida, Kiyosu (JP)
Assigned to FUJIMI INCORPORATED, Kiyosu (JP)
Filed by FUJIMI INCORPORATED, Kiyosu (JP)
Filed on Feb. 21, 2020, as Appl. No. 16/797,177.
Claims priority of application No. 2019-061627 (JP), filed on Mar. 27, 2019; and application No. 2019-178322 (JP), filed on Sep. 30, 2019.
Prior Publication US 2020/0308449 A1, Oct. 1, 2020
Int. Cl. C09G 1/02 (2006.01)

CPC C09G 1/02 (2013.01)

23 Claims

1. A polishing composition comprising:

an abrasive grain having an organic acid immobilized on a surface thereof;

a first water-soluble polymer having a sulfonic acid group or a group having a salt thereof, or a carboxyl group or a group having a salt thereof;

a second water-soluble polymer different from the first water-soluble polymer;

a nonionic surfactant, wherein the nonionic surfactant has a glycerin structure and an alkyl group having 4 or more carbon atoms; and

an aqueous carrier,

wherein the polishing composition is used for polishing an object to be polished.