US 11,702,569 B2
Slurry and polishing method
Takaaki Matsumoto, Tokyo (JP); Tomohiro Iwano, Tokyo (JP); and Tomoyasu Hasegawa, Tokyo (JP)
Assigned to RESONAC CORPORATION, Tokyo (JP)
Appl. No. 16/642,120
Filed by HITACHI CHEMICAL COMPANY, LTD., Tokyo (JP)
PCT Filed Aug. 30, 2018, PCT No. PCT/JP2018/032133
§ 371(c)(1), (2) Date Feb. 26, 2020,
PCT Pub. No. WO2019/044978, PCT Pub. Date Mar. 7, 2019.
Claims priority of application No. PCT/JP2017/031087 (WO), filed on Aug. 30, 2017.
Prior Publication US 2020/0299545 A1, Sep. 24, 2020
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01); H01L 21/3105 (2006.01)
CPC C09G 1/02 (2013.01) [C09K 3/1436 (2013.01); H01L 21/31053 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A slurry comprising:
abrasive grains;
a liquid medium; and
a salt of a compound represented by formula (1) below

OG Complex Work Unit Chemistry
in formula (1), R represents a hydroxyl group or a monovalent organic group, wherein
the abrasive grains include first particles and second particles in contact with the first particles,
the first particles contain cerium oxide,
the second particles contain a hydroxide of a tetravalent metal element,
the average particle size of the second particles is smaller than the average particle size of the first particles,
the average secondary particle size of the abrasive grains is more than 100 nm,
the salt of the compound represented by formula (1) contains at least one selected from the group consisting of a compound represented by formula (2) below and a compound represented by formula (3) below

OG Complex Work Unit Chemistry
in formula (2), R represents a hydroxyl group or a monovalent organic group, and X+ represents an ammonium ion,

OG Complex Work Unit Chemistry
in formula (3), R represents a hydroxyl group or a monovalent organic group, and X+ represents an ammonium ion, and
pH of the slurry is 7.0 or lower.