US 11,702,504 B2
Resin composition for printed wiring board, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board
Shohei Yamaguchi, Tokyo (JP); Katsuya Tomizawa, Tokyo (JP); Norihiro Shida, Tokyo (JP); and Hidetoshi Kawai, Tokyo (JP)
Assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
Appl. No. 17/264,528
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Jun. 28, 2019, PCT No. PCT/JP2019/025921
§ 371(c)(1), (2) Date Jan. 29, 2021,
PCT Pub. No. WO2020/031545, PCT Pub. Date Feb. 13, 2020.
Claims priority of application No. 2018-150563 (JP), filed on Aug. 9, 2018.
Prior Publication US 2021/0301071 A1, Sep. 30, 2021
Int. Cl. C08G 59/50 (2006.01); B32B 15/14 (2006.01); H05K 1/03 (2006.01); B32B 5/02 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); B32B 5/26 (2006.01); B32B 15/20 (2006.01); C08G 59/40 (2006.01); C08G 59/62 (2006.01)
CPC C08G 59/5073 (2013.01) [B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/245 (2013.01); C08G 59/4042 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2461/04 (2013.01); C08J 2479/08 (2013.01); H05K 2201/0209 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A resin composition for a printed wiring board, comprising:
a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F),
wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.