CPC C08G 59/5073 (2013.01) [B32B 5/024 (2013.01); B32B 5/263 (2021.05); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/245 (2013.01); C08G 59/4042 (2013.01); C08G 59/621 (2013.01); C08G 59/686 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2264/1021 (2020.08); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2461/04 (2013.01); C08J 2479/08 (2013.01); H05K 2201/0209 (2013.01)] | 16 Claims |
1. A resin composition for a printed wiring board, comprising:
a phenolic compound (A); a maleimide compound (B); an epoxy compound (C); a cyclic carbodiimide compound (D); an inorganic filler (E); and a curing accelerator (F),
wherein a content of the inorganic filler (E) is 100 to 250 parts by mass based on 100 parts by mass of a resin solid content.
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