US 11,701,872 B1
Insulation panel
Charles-Alexandre Vincent, St. Bruno de Montarville (CA); and James McGoff, Silver Spring, MD (US)
Assigned to TEMPERPACK TECHNOLOGIES, INC., Richmond, VA (US)
Filed by TemperPack Technologies, Inc., Richmond, VA (US)
Filed on Oct. 12, 2020, as Appl. No. 17/68,514.
Application 17/068,514 is a continuation in part of application No. 16/518,864, filed on Jul. 22, 2019, granted, now 10,800,596.
Application 16/518,864 is a continuation in part of application No. 15/855,285, filed on Dec. 27, 2017, granted, now 10,357,936, issued on Jul. 23, 2019.
Claims priority of provisional application 62/491,651, filed on Apr. 28, 2017.
Claims priority of provisional application 62/491,666, filed on Apr. 28, 2017.
This patent is subject to a terminal disclaimer.
Int. Cl. B32B 3/18 (2006.01); B32B 3/26 (2006.01); B32B 7/14 (2006.01); B32B 27/06 (2006.01); B32B 37/10 (2006.01); B65D 81/38 (2006.01); B32B 27/14 (2006.01); B32B 7/12 (2006.01); B32B 5/18 (2006.01)
CPC B32B 27/14 (2013.01) [B32B 3/263 (2013.01); B32B 5/18 (2013.01); B32B 7/12 (2013.01); B32B 2307/304 (2013.01)] 21 Claims
OG exemplary drawing
 
1. An insulation structure having an insulation panel comprising:
an insulation core layer comprising at least one puffed polysaccharide unit;
one or more outer barriers disposed about the insulation core layer; and
at least one heat seal formed between the insulation core layer and the one or more outer barriers, wherein a first portion of the insulation core layer is compressed and thermoset with a first thickness, the first thickness being less than a second thickness of the insulation panel at a second non-heat seal portion of the insulation panel, the first portion of the insulation core layer adhering to the one or more outer barriers at the at least one heat seal as the heat seal is formed, and at least a portion of the second non-heat seal portion of the insulation core layer not adhering to the one or more outer barriers.