CPC B32B 15/088 (2013.01) [B29C 45/14 (2013.01); B32B 3/30 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/34 (2013.01); C08K 5/098 (2013.01); C08L 77/06 (2013.01); B29K 2077/00 (2013.01); B29K 2705/02 (2013.01); B29L 2009/00 (2013.01); C08L 2205/02 (2013.01); C08L 2205/16 (2013.01)] | 13 Claims |
1. A metal/resin composite structure comprising:
a metal member (M) having a fine uneven surface comprising a plurality of protrusions; and
a polyamide-based resin member (A) bonded to the fine uneven surface of the metal member (M), wherein the polyamide-based resin member (A) is formed from a polyamide resin which comprises
at least one semi-aromatic polyamide selected from the group consisting of polyhexamethylene isophthalamide (polyamide 6I), polyhexamethylene adipamide/polyhexamethylene isophthalamide copolymer (polyamide 66/6I), polyhexamethylene isophthalamide/polycaproamide copolymer (polyamide 6I/6), polyhexamethylene adipamide/polyhexamethylene terephthalamide/polyhexamethylene isophthalamide copolymer (polyamide 66/6T/6I), polyhexamethylene adipamide/polycaproamide/-polyhexamethylene isophthalamide copolymer (polyamide 66/6/6I), polyhexamethylene isophthalamide/polyhexamethylene terephthalamide copolymer (polyamide 6116T), and poly(2-methylpentamethylene terephthalamide)/poly(2-methylpentamethylene isophthalamide) copolymer (polyamide M5T/M5I); and
at least one polyamide selected from the group consisting of polyhexamethylene terephthalamide (polyamide 6T), polyhexamethylene adipamide/polyhexamethylene terephthalamide copolymer (polyamide 66/6T), and polyhexamethylene terephthalamide/polyhexamethylene isophthalamide copolymer (polyamide 6T/6I),
wherein the polyamide-based resin member (A) satisfies the following condition [A1] and condition [A2]:
[A1] a glass transition temperature (Tg) observed by a differential scanning calorimeter (DSC) equal to or higher than 85° C. and equal to or lower than 140° C.; and
[A2] a crystallization temperature (Tc) observed by a DSC is equal to or higher than 250° C. and equal to or lower than 292° C., and
wherein the polyamide-based resin member (A) includes a metal soap, wherein the metal soap includes montanic acid soap and 12-hydroxystearic acid soap, and the content of the montanic acid soap relative to 100% by mass of the metal soap is more than 20% by mass and less than 100% by mass.
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