US 11,701,707 B2
Components having low aspect ratio
Sergey Mironets, Szymanow (PL); and William Louis Wentland, Rockford, IL (US)
Assigned to HAMILTON SUNDSTRAND CORPORATION, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Aug. 5, 2021, as Appl. No. 17/394,585.
Application 17/394,585 is a continuation of application No. 16/665,079, filed on Oct. 28, 2019, granted, now 11,084,092.
Claims priority of application No. 18461620 (EP), filed on Oct. 27, 2018.
Prior Publication US 2021/0362229 A1, Nov. 25, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. B22F 3/14 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B22F 5/08 (2006.01); B22F 10/20 (2021.01); B22F 10/28 (2021.01)
CPC B22F 5/08 (2013.01) [B22F 3/14 (2013.01); B22F 10/28 (2021.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12)] 19 Claims
OG exemplary drawing
 
1. A method of manufacturing a component comprising:
making a preform from a powdered material, wherein the preform is made with a first portion having a first density and a second portion having a second density that is lower than the first density, and wherein the first and second portions of the preform have a density in a range from 70 to 95% of theoretical density of the material; and
sintering the preform using a Field Assisted Sintering Technique (FAST) process to produce a component having a density of greater than 97% of the theoretical density of the material, wherein the FAST process comprises applying an electric potential across the preform via opposed conductive dies which are arranged to apply pressure simultaneously in order to consolidate the preform; and
wherein the opposed dies each comprise a die surface and at least one of the die surfaces has been profiled so as to vary in height across the die surface and thereby provide a die cavity defined by a first die separation and a second die separation that is smaller than the first die separation, and wherein only the first portion is positioned in the first die separation prior to the FAST process and only the second portion is positioned in the second die separation prior to the FAST process.