David Quijano, Spring, TX (US); Stacy L. Wolff, Spring, TX (US); Owen P. Columbus, Spring, TX (US); Paul L. Drew, Spring, TX (US); Marcus Hoggarth, London (GB); Cian Plumbe, London (GB); Seong Min Hwang, London (GB); Ben Henley, London (GB); Benjamin Keep, London (GB); and Jaineel Shah, London (GB)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
Filed on Sep. 14, 2021, as Appl. No. 29/807,753.
Term of patent 15 Years
LOC (14) Cl. 14 - 02
U.S. Cl. D14—336
The ornamental design for a conference device, as shown and described.
