CPC H04N 23/55 (2023.01) [H04M 1/0264 (2013.01); H04N 23/52 (2023.01)] | 16 Claims |
1. A camera module comprising:
a circuit board;
a lens assembly;
a filter; and
a mounting frame;
wherein the lens assembly is arranged on the circuit board, the mounting frame is arranged between the circuit board and the lens assembly; a through hole penetrates the mounting frame, a protrusion extends from an inner surface defining the through hole toward a central axis of the through hole, the filter is mounted on a side of the protrusion facing away from the circuit board, a first barrier layer is arranged on an edge area of a surface of the filter facing away from the circuit board, a gap is formed between the filter and the inner surface of the mounting frame, a second barrier layer is located in the gap, a surface of the second barrier layer facing away from the circuit board is located at a side of the first barrier layer facing away from the circuit board, the mounting frame comprises a top surface facing away from the circuit board, the lens assembly is fixed on the top surface, and the second barrier layer further covers at least part of the top surface.
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