CPC H04B 1/086 (2013.01) [H01L 23/66 (2013.01); H04W 92/00 (2013.01)] | 24 Claims |
1. A semiconductor chip comprising:
a first wireless communication circuit, comprising a signal path, wherein the signal path comprises a mixer input port and a signal node distinct from the mixer input port;
a local oscillator (LO) buffer, arranged to receive and buffer an LO signal; and
an auxiliary path, arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a transmit (TX) function through the auxiliary path;
wherein when the LO buffer is reused for the TX function through the auxiliary path, at least a portion of circuits at the signal path is disabled.
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