US 11,695,439 B2
Semiconductor chip with local oscillator buffer reused for signal transmission and associated transmission method
Jui-Lin Hsu, Hsinchu (TW); Yen-Tso Chen, Hsinchu (TW); Hsiang-Yun Chu, Hsinchu (TW); Jen-Hao Cheng, Hsinchu (TW); Wei-Hsiu Hsu, Hsinchu (TW); Tzu-Chin Lin, Hsinchu (TW); Chih-Ming Hung, San Jose, CA (US); and Jing-Hong Conan Zhan, Hsinchu (TW)
Assigned to MEDIATEK INC., Hsin-Chu (TW)
Filed by MEDIATEK INC., Hsin-Chu (TW)
Filed on Oct. 19, 2021, as Appl. No. 17/505,605.
Claims priority of provisional application 63/107,569, filed on Oct. 30, 2020.
Prior Publication US 2022/0140849 A1, May 5, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/40 (2015.01); H04B 1/48 (2006.01); H04B 1/08 (2006.01); H01L 23/66 (2006.01); H04W 92/00 (2009.01)
CPC H04B 1/086 (2013.01) [H01L 23/66 (2013.01); H04W 92/00 (2013.01)] 24 Claims
OG exemplary drawing
 
1. A semiconductor chip comprising:
a first wireless communication circuit, comprising a signal path, wherein the signal path comprises a mixer input port and a signal node distinct from the mixer input port;
a local oscillator (LO) buffer, arranged to receive and buffer an LO signal; and
an auxiliary path, arranged to electrically connect the LO buffer to the signal node of the signal path, wherein the LO buffer is reused for a transmit (TX) function through the auxiliary path;
wherein when the LO buffer is reused for the TX function through the auxiliary path, at least a portion of circuits at the signal path is disabled.