US 11,695,091 B2
Transfer method, display device, and storage medium
Qiang Li, Chongqing (CN)
Assigned to CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD., Chongqing (CN)
Filed by CHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE CO., LTD., Chongqing (CN)
Filed on Jun. 14, 2021, as Appl. No. 17/347,144.
Application 17/347,144 is a continuation of application No. PCT/CN2020/090290, filed on May 14, 2020.
Prior Publication US 2021/0359156 A1, Nov. 18, 2021
Int. Cl. H01L 33/00 (2010.01); H01L 25/075 (2006.01)
CPC H01L 33/0095 (2013.01) [H01L 25/0753 (2013.01); H01L 33/0093 (2020.05)] 20 Claims
OG exemplary drawing
 
1. A transfer method, comprising:
performing partial cutting on preset scribe lines on an epitaxial layer on a growth substrate to obtain to-be-transferred wafers after cutting, wherein a cutting depth is less than a depth of the epitaxial layer;
providing a temporary substrate having a first release adhesive, adhering the first release adhesive to first side faces of the to-be-transferred wafers so as to adhere the to-be-transferred wafers to the temporary substrate, and peeling off the growth substrate;
providing a blue tape having a second release adhesive, adhering the second release adhesive to second side faces of the to-be-transferred wafers so as to adhere the to-be-transferred wafers to the blue tape, and peeling off the temporary substrate, wherein the first side faces and the second side faces are arranged in opposite correspondingly; and
providing a roller that is arranged at the bottom of the blue tape and opposite to the to-be-transferred wafers, and jacking up the blue tape with the roller so that remaining scribe lines on the to-be-transferred wafers are separated by breaking under action of stress.