US 11,694,991 B2
Method for transferring chips
Frank Fournel, Grenoble (FR); Emilie Bourjot, Grenoble (FR); Séverine Cheramy, Grenoble (FR); Sylvain Maitrejean, Grenoble (FR); and Loic Sanchez, Grenoble (FR)
Assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed by COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES, Paris (FR)
Filed on Jun. 24, 2021, as Appl. No. 17/304,664.
Claims priority of application No. 20 06667 (FR), filed on Jun. 25, 2020.
Prior Publication US 2021/0407961 A1, Dec. 30, 2021
Int. Cl. H01L 21/683 (2006.01); H01L 23/00 (2006.01); B32B 38/00 (2006.01); B32B 38/18 (2006.01); H01L 21/67 (2006.01)
CPC H01L 24/97 (2013.01) [B32B 38/00 (2013.01); B32B 38/18 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 2224/95085 (2013.01); H01L 2224/97 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A method for transferring at least one chip, from a first support to a second support, comprising:
forming, while the chip is integral with the first support, an interlayer in a liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support, and then a solidification of the interlayer in a solid state; and
then, detaching the chip from the first support while maintaining the interlayer in the solid state,
wherein the solidification comprises placing the assembly surface of the face of the second support at a temperature below a solidification temperature of the interlayer,
wherein the forming the interlayer comprises forming a liquid coating configured to form the interlayer on the front face of the chip, then approaching the first support and the second support so as to contact the liquid coating and the assembly surface of the face of the second support,
wherein the placing the assembly surface of the face of the second support at a temperature below a solidification temperature of the interlayer is carried out before contacting the liquid coating with the assembly surface of the face of the second support, and
wherein the detaching comprises a relative displacement of the first support and of the second support configured to break a mechanical bond between the first support and the chip.