US 11,694,976 B2
Bowl shaped pad
Yuhong Cai, Folsom, CA (US); Sireesha Gogineni, Folsom, CA (US); and Yi Xu, Folsom, CA (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Oct. 11, 2018, as Appl. No. 16/158,042.
Prior Publication US 2020/0118954 A1, Apr. 16, 2020
Int. Cl. H01L 23/00 (2006.01)
CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 2224/03612 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/13026 (2013.01)] 16 Claims
OG exemplary drawing
 
1. An interconnect structure, comprising:
a substrate; and
a metal pad over the substrate, wherein the metal pad has a center region and an edge region, wherein a thickness of the center region is smaller than a thickness of the edge region, wherein a thickness of the center region is non-uniform, wherein the center region is characterized by a stepped profile, wherein the stepped profile is formed from steps, and wherein each step comprises a horizontal surface and a vertical surface.