CPC H01L 24/05 (2013.01) [H01L 24/03 (2013.01); H01L 24/13 (2013.01); H01L 2224/03612 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05011 (2013.01); H01L 2224/13026 (2013.01)] | 16 Claims |
1. An interconnect structure, comprising:
a substrate; and
a metal pad over the substrate, wherein the metal pad has a center region and an edge region, wherein a thickness of the center region is smaller than a thickness of the edge region, wherein a thickness of the center region is non-uniform, wherein the center region is characterized by a stepped profile, wherein the stepped profile is formed from steps, and wherein each step comprises a horizontal surface and a vertical surface.
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