US 11,694,971 B1
Electro-optic package featuring sputtered EMI shield
Roberto Coccioli, San Jose, CA (US); Poorna Chander Ravva, San Jose, CA (US); Dwayne Richard Shirley, San Jose, CA (US); Jing Li, San Jose, CA (US); Shrinath Ramdas, San Jose, CA (US); Hassan Kobeissi, San Jose, CA (US); and Shaohui Yong, San Jose, CA (US)
Assigned to MARVELL ASIA PTE LTD, Singapore (SG)
Filed by MARVELL ASIA PTE LTD., Singapore (SG)
Filed on Apr. 13, 2021, as Appl. No. 17/229,491.
Int. Cl. H01L 23/60 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/552 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/3025 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A packaged electronic device comprising:
a substrate in electrical contact with a die;
a mold compound in contact with the substrate and with one or more sides of the die; and
a sputtered metal shield comprising a first layer of a first metal and a second layer of a second metal formed on the first layer, the sputtered metal shield being applied by sputtering and being in contact with the mold compound and with the substrate and extending to a bottom surface of the substrate.