CPC H01L 23/5387 (2013.01) [H01L 23/49866 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/16 (2013.01); H01L 25/18 (2013.01); H01L 2224/16227 (2013.01)] | 19 Claims |
1. A flexible circuit board comprising:
a substrate;
a first conductive pattern part disposed on a first surface of the substrate;
a second conductive pattern part disposed on a second surface opposite to the first surface of the substrate;
a first dummy pattern part disposed in a region of the second surface of the substrate in which the second conductive pattern part is not disposed;
a first protection layer disposed on the first conductive pattern part; and
a second protection layer disposed on the second conductive pattern part and the first dummy pattern part,
wherein the first conductive pattern part at an outermost periphery of the substrate is covered by the first protection layer, and
wherein the first dummy pattern part includes:
a first wiring pattern layer, and
a first plating layer including tin (Sn) disposed on the first wiring pattern layer.
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