US 11,694,946 B2
Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof
Jae Min Bae, Seoul (KR); Hyung Jun Cho, Incheon (KR); and Seung Woo Lee, Incheon (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Valley Point (SG)
Filed on May 24, 2021, as Appl. No. 17/328,861.
Prior Publication US 2022/0375834 A1, Nov. 24, 2022
Int. Cl. H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/49555 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 23/4951 (2013.01); H01L 23/4952 (2013.01); H01L 23/49524 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 25/0657 (2013.01); H01L 25/072 (2013.01)] 27 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a substrate comprising leads, the leads comprising:
lead terminals;
lead steps; and
lead offsets extending between the lead steps so that at least some lead steps reside on different planes;
a first electronic component coupled to a first lead step side, the first electronic component comprising:
a first electronic component first side comprising a first active side; and
a first electronic component second side opposite to the first electronic component first side;
a second electronic component coupled to a second lead step side, the second electronic component comprising:
a second electronic component first side comprising a second active side; and
a second electronic component second side opposite to the second electronic component first side;
conductive bumps comprising a first conductive bump and a second conductive bump; and
an encapsulant encapsulating the first electronic component, the second electronic component, the first conductive bump, the second conductive bump, and portions of the substrate,
wherein:
the first active side faces and is connected to the first lead step side with the first conductive bump;
the second active side faces and is connected to the second lead step side with the second conductive bump;
the lead terminals are exposed from a first side of the encapsulant;
the first electronic component second side is exposed from a second side of the encapsulant; and
the second side of the encapsulant is different than the first side of the encapsulant.