US 11,694,918 B2
Method and device for wafer taping
Peng Chen, Wuhan (CN); MingLiang Li, Wuhan (CN); and Jian Miao, Wuhan (CN)
Assigned to Yangtze Memory Technologies Co., Ltd., Wuhan (CN)
Filed by Yangtze Memory Technologies Co., Ltd., Wuhan (CN)
Filed on Sep. 22, 2021, as Appl. No. 17/481,337.
Application 17/481,337 is a division of application No. 16/538,834, filed on Aug. 13, 2019, granted, now 11,232,969.
Application 16/538,834 is a continuation of application No. PCT/CN2019/076113, filed on Feb. 26, 2019.
Prior Publication US 2022/0005724 A1, Jan. 6, 2022
Int. Cl. H01L 21/683 (2006.01)
CPC H01L 21/6836 (2013.01) [H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 2221/68327 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for taping a wafer, comprising:
providing a wafer taping device comprising a wafer stage;
mounting a wafer on the wafer stage;
delivering a tape along a first direction over the wafer;
forcing the tape into adhesion with a surface of the wafer in a non-contact manner, wherein said forcing the tape into adhesion with a surface of the wafer in a non-contact manner comprises disposing an air blade with a slot-shaped air outlet in the wafer taping device, wherein the air blade provides an air flow with adequate and stable air pressure to force the tape into adhesion with the surface of the wafer, wherein the air blade is rotated and positioned at a specific angle with respect to the surface of the wafer; and
cutting the tape along a perimeter of the wafer.