CPC H01L 21/6836 (2013.01) [H01L 21/6831 (2013.01); H01L 21/6838 (2013.01); H01L 2221/68327 (2013.01)] | 15 Claims |
1. A method for taping a wafer, comprising:
providing a wafer taping device comprising a wafer stage;
mounting a wafer on the wafer stage;
delivering a tape along a first direction over the wafer;
forcing the tape into adhesion with a surface of the wafer in a non-contact manner, wherein said forcing the tape into adhesion with a surface of the wafer in a non-contact manner comprises disposing an air blade with a slot-shaped air outlet in the wafer taping device, wherein the air blade provides an air flow with adequate and stable air pressure to force the tape into adhesion with the surface of the wafer, wherein the air blade is rotated and positioned at a specific angle with respect to the surface of the wafer; and
cutting the tape along a perimeter of the wafer.
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