US 11,694,882 B2
Substrate processing apparatus and substrate processing method
Yuji Takanami, Tokyo (JP); Kento Norota, Sagamihara (JP); Naoyuki Okamoto, Sagamihara (JP); Yasuo Kato, Machida (JP); and Yasushi Yasumatsu, Inagi (JP)
Assigned to CANON ANELVA CORPORATION, Kawasaki (JP)
Filed by Canon Anelva Corporation, Kawasaki (JP)
Filed on Jan. 21, 2022, as Appl. No. 17/580,813.
Application 17/580,813 is a division of application No. 16/928,086, filed on Jul. 14, 2020, granted, now 11,270,873.
Application 16/928,086 is a continuation of application No. PCT/JP2019/003362, filed on Jan. 31, 2019.
Claims priority of application No. 2018-019569 (JP), filed on Feb. 6, 2018.
Prior Publication US 2022/0139686 A1, May 5, 2022
Int. Cl. H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/46 (2006.01); H01J 37/32 (2006.01)
CPC H01J 37/3435 (2013.01) [C23C 14/3442 (2013.01); C23C 14/46 (2013.01); H01J 37/32733 (2013.01); H01J 2237/332 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A substrate processing method of processing a substrate, comprising:
a processing step of processing the substrate using particles emitted from a particle source while conveying the substrate in a predetermined conveyance direction along a conveyance surface and controlling a posture and a position of the particle source that emits particles,
wherein a target processing portion of the substrate, which is a portion to be processed using the particles, changes as the substrate is conveyed, and
the processing step includes a driving step of, in accordance with a change of the target processing portion of the substrate, making the particle source pivot about a rotation axis orthogonal to the conveyance direction and moving the particle source such that a distance between the particle source and the conveyance surface is changed;
wherein
the particle source is a target held by a cathode, and
a film is formed on the substrate using particles emitted by sputtering of the cathode.