CPC H01J 37/3435 (2013.01) [C23C 14/3442 (2013.01); C23C 14/46 (2013.01); H01J 37/32733 (2013.01); H01J 2237/332 (2013.01)] | 13 Claims |
1. A substrate processing method of processing a substrate, comprising:
a processing step of processing the substrate using particles emitted from a particle source while conveying the substrate in a predetermined conveyance direction along a conveyance surface and controlling a posture and a position of the particle source that emits particles,
wherein a target processing portion of the substrate, which is a portion to be processed using the particles, changes as the substrate is conveyed, and
the processing step includes a driving step of, in accordance with a change of the target processing portion of the substrate, making the particle source pivot about a rotation axis orthogonal to the conveyance direction and moving the particle source such that a distance between the particle source and the conveyance surface is changed;
wherein
the particle source is a target held by a cathode, and
a film is formed on the substrate using particles emitted by sputtering of the cathode.
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