US 11,694,846 B2
Multilayer ceramic electronic component
Young Joon Oh, Suwon-si (KR); Yun Jeong Cha, Suwon-si (KR); Hyo Min Kang, Suwon-si (KR); Jun Oh Kim, Suwon-si (KR); Ji Eun Oh, Suwon-si (KR); and Jeong Ryeol Kim, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Aug. 16, 2021, as Appl. No. 17/403,185.
Claims priority of application No. 10-2020-0149515 (KR), filed on Nov. 10, 2020; and application No. 10-2021-0075922 (KR), filed on Jun. 11, 2021.
Prior Publication US 2022/0148809 A1, May 12, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and
a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes,
wherein the dielectric layer includes silicon (Si),
each of the first and second internal electrodes includes Si and a conductive metal, and
a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.