CPC H01G 4/30 (2013.01) [H01G 4/008 (2013.01); H01G 4/012 (2013.01)] | 18 Claims |
1. A multilayer ceramic electronic component comprising:
a ceramic body including dielectric layers and first and second internal electrodes alternately stacked with respective dielectric layers interposed therebetween; and
a first external electrode connected to the first internal electrodes and a second external electrode connected to the second internal electrodes,
wherein the dielectric layer includes silicon (Si),
each of the first and second internal electrodes includes Si and a conductive metal, and
a ratio (B/A) of an average content (B) (wt %) of Si included in each of the first and second internal electrodes to an average content (A) (wt %) of Si included in the dielectric layer is 0.99 or more and 1.41 or less.
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