US 11,694,843 B2
Multilayer capacitor and method of manufacturing the same
Yun Sung Kang, Suwon-si (KR); Min Jung Cho, Suwon-si (KR); and Yun Hee Kim, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 14, 2021, as Appl. No. 17/320,966.
Claims priority of application No. 10-2020-0146115 (KR), filed on Nov. 4, 2020.
Prior Publication US 2022/0139616 A1, May 5, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/248 (2006.01); H01G 4/008 (2006.01)
CPC H01G 4/0085 (2013.01) [H01G 4/248 (2013.01); H01G 4/30 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A multilayer capacitor comprising:
a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween;
external electrodes disposed on external surfaces of the body and connected to the internal electrodes; and
an insulating layer covering a surface of the body,
wherein one of the external electrodes includes a metal layer connected to the insulating layer,
the insulating layer includes an oxide of a metal component of the metal layer,
the one of the external electrodes further includes an electrode layer covering the metal layer, and
the electrode layer includes one of a sintered electrode and a conductive resin electrode.