US 11,694,835 B2
Inductor device
Hsiao-Tsung Yen, Hsinchu (TW); and Ka-Un Chan, Hsinchu (TW)
Assigned to REALTEK SEMICONDUCTOR CORPORATION, Hsinchu (TW)
Filed by Realtek Semiconductor Corporation, Hsinchu (TW)
Filed on Jun. 24, 2020, as Appl. No. 16/910,292.
Claims priority of provisional application 62/871,263, filed on Jul. 8, 2019.
Claims priority of application No. 109117888 (TW), filed on May 28, 2020.
Prior Publication US 2021/0012946 A1, Jan. 14, 2021
Int. Cl. H01F 27/28 (2006.01); H03H 7/09 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/2828 (2013.01); H01F 27/29 (2013.01); H03H 7/09 (2013.01); H01F 2017/004 (2013.01); H01F 2017/0073 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inductor device, comprising:
a first trace disposed in a first area;
a second trace disposed in a second area;
a double ring inductor disposed at an outside of the first trace and the second trace, wherein the double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner; and
a first connector coupled to traces of the double ring inductor at an outer side of the double ring inductor, wherein an entirety of the double ring inductor and the first connector are disposed on different layers.