US 11,693,325 B2
Methods and systems for reducing particulate deposition on photomask
Jui Chieh Chen, Hsinchu (TW); and Yi-Wei Lee, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 28, 2021, as Appl. No. 17/360,440.
Claims priority of provisional application 63/172,793, filed on Apr. 9, 2021.
Prior Publication US 2022/0326628 A1, Oct. 13, 2022
Int. Cl. G03F 7/20 (2006.01); G03F 7/00 (2006.01)
CPC G03F 7/70875 (2013.01) [G03F 7/70033 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method for reducing particulate deposition rate on a photomask, comprising:
generating a plasma that emits EUV radiation in a radiation source chamber and also produces particulates;
producing turbulence within the radiation source chamber by changing the temperature in the radiation source chamber between a first temperature setpoint and a second temperature setpoint, wherein the first temperature setpoint and the second temperature setpoint differ by at least 50° C.; and
wherein the turbulence reduces a level of particulates exiting the radiation source chamber and entering a processing chamber containing the photomask.