US 11,693,309 B2
Imprint apparatus, imprint method, and method for manufacturing article
Hiroki Echigo, Utsunomiya (JP)
Assigned to CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 26, 2019, as Appl. No. 16/395,863.
Claims priority of application No. 2018-093966 (JP), filed on May 15, 2018.
Prior Publication US 2019/0354007 A1, Nov. 21, 2019
Int. Cl. G03F 7/00 (2006.01)
CPC G03F 7/0002 (2013.01) 18 Claims
OG exemplary drawing
 
1. An imprint apparatus which brings an imprint material on a substrate into contact with a mold and forms a pattern made of the imprint material, comprising:
a mold holding unit configured to hold the mold;
a substrate holding unit configured to hold the substrate;
a detecting unit configured to detect an occurrence of desorption of the mold from the mold holding unit, an occurrence of desorption of the substrate from the substrate holding unit, and a position of the mold and the substrate; and
a controller configured to
i) perform determination of whether an abnormal state has occurred, including the determining of the occurrence of desorption of the mold and the occurrence of desorption of the substrate based on a detection of the detecting unit;
ii) in a case that it has been determined that the abnormal state has occurred, perform a determination concerning whether or not it is possible to perform a return process without damage to the mold or substrate in which a state in which the abnormal state has occurred to a normal state, wherein the determination concerning whether or not it is possible to perform the return process without damage to the mold or substrate is made on a basis of a detection result of which of the mold holding unit and the substrate holding unit is in abnormal state and the position of the mold and the substrate detected by the detecting unit when the abnormal state occurs; and
iii) execute the return process in a case that it is determined that it is possible to perform the return process without damage to the mold or substrate,
wherein the detection of the position of the mold and the substrate is performed by using an alignment detector which performs measurement for alignment between the mold and the substrate as a part of the detecting unit.