US 11,693,308 B2
Molding apparatus that molds composition on substrate by using mold, molding method, and manufacturing method of article
Keiji Yamashita, Utsunomiya (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Apr. 19, 2019, as Appl. No. 16/389,811.
Claims priority of application No. 2018-085318 (JP), filed on Apr. 26, 2018.
Prior Publication US 2019/0332007 A1, Oct. 31, 2019
Int. Cl. G03F 7/00 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/0002 (2013.01) [H01L 21/0274 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A molding apparatus for molding a composition on a substrate by using a mold, comprising:
a mold holding unit configured to hold the mold;
a moving unit configured to hold and move the substrate;
a first supply port configured to supply gaseous matter between the substrate and the mold from a direction above the substrate;
a second supply port configured to directly supply the gaseous matter to a space surrounded by a plurality of faces including the side face of the substrate and the upper face of the moving unit; and
a control unit configured to control the supply of the gaseous matter from the first supply port and the second supply port,
wherein the first supply port is arranged in a periphery of the mold holding unit,
wherein the second supply port is arranged, across the space, in a position opposing to the side face of the substrate, or in the lower side of the space, and
wherein, when the moving unit holds and moves the substrate of which a molding area is supplied with the composition, the control unit controls the supply of the gaseous matter to be supplied from both of the first supply port and the second supply port.