US 11,693,200 B2
Double bonding when fabricating an optical device
Vipulkumar K. Patel, Breinigsville, PA (US); Ravi S. Tummidi, Breinigsville, PA (US); and Mark A. Webster, Bethlehem, PA (US)
Assigned to Cisco Technology, Inc., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on Jul. 19, 2021, as Appl. No. 17/305,986.
Prior Publication US 2023/0015671 A1, Jan. 19, 2023
Int. Cl. G02B 6/43 (2006.01); G02B 6/42 (2006.01)
CPC G02B 6/43 (2013.01) [G02B 6/425 (2013.01); G02B 6/4236 (2013.01); G02B 6/4274 (2013.01); G02B 6/4204 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method, comprising:
providing an optical device in a first semiconductor wafer;
providing an optical element in a second semiconductor wafer;
wafer bonding the first semiconductor wafer and the second semiconductor wafer to form a combined wafer, wherein bonding the first semiconductor wafer and the second semiconductor wafer optically couples the optical device to the optical element, and wherein the optical device is optically coupled to the optical element to form an optical adapter for transmitting an optical signal between the optical device and an external light source;
removing a substrate corresponding to the second semiconductor wafer from the combined wafer; and
performing a second wafer bonding process either (i) before forming the combined wafer or (ii) after removing the substrate corresponding to the second semiconductor wafer.