US 11,693,149 B2
Molded range and proximity sensor with optical resin lens
Wing Shenq Wong, Singapore (SG); Andy Price, Bonnyrigg (GB); and Eric Christison, Edinburgh (GB)
Assigned to STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, Marlow (GB); and STMICROELECTRONICS PTE LTD, Singapore (SG)
Filed by STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED, Marlow (GB); and STMICROELECTRONICS PTE LTD, Singapore (SG)
Filed on Aug. 25, 2021, as Appl. No. 17/411,948.
Application 17/411,948 is a continuation of application No. 16/890,778, filed on Jun. 2, 2020, granted, now 11,137,517.
Application 16/890,778 is a continuation of application No. 16/107,911, filed on Aug. 21, 2018, granted, now 10,684,389, issued on Jun. 16, 2020.
Application 16/107,911 is a continuation of application No. 14/832,971, filed on Aug. 21, 2015, granted, now 10,061,057, issued on Aug. 28, 2018.
Prior Publication US 2021/0382197 A1, Dec. 9, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/16 (2023.01); H01L 31/167 (2006.01); G01V 8/12 (2006.01)
CPC G01V 8/12 (2013.01) [H01L 25/167 (2013.01); H01L 31/167 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
a semiconductor die having a first surface and a second surface;
a light sensor in the semiconductor die and between the first surface and the second surface;
a light emitting device on the first surface of the semiconductor die;
a glue stopper element on the first surface and between the light emitting device and the light sensor;
a first resin lens that encapsulates the light emitting device on the first surface;
a second resin lens that encapsulates the light sensor on the first surface; and
a molding compound surrounds the first resin lens, surrounds the second resin lens, is on the glue stopper element, and is on the semiconductor die.