CPC G01V 8/12 (2013.01) [H01L 25/167 (2013.01); H01L 31/167 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01)] | 20 Claims |
1. A structure, comprising:
a semiconductor die having a first surface and a second surface;
a light sensor in the semiconductor die and between the first surface and the second surface;
a light emitting device on the first surface of the semiconductor die;
a glue stopper element on the first surface and between the light emitting device and the light sensor;
a first resin lens that encapsulates the light emitting device on the first surface;
a second resin lens that encapsulates the light sensor on the first surface; and
a molding compound surrounds the first resin lens, surrounds the second resin lens, is on the glue stopper element, and is on the semiconductor die.
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